Sophisticated compound
contact profiles are ideal for meeting these needs.
What is a Compound Contact Profile?
Compound contact profiles are special strips consisting of three layers of material:
1. Electrical contact layer: This layer is responsible for conducting electricity and making contact with the paired contacts. It is usually made of gold or gold alloys and has a thickness of only 1 to 10 μm.
2. Intermediate layer: This takes over the function of the electrical contact layer when it wears out, usually made of silver or silver-based materials.
3. Substrate layer: This layer supports the entire strip and is usually made of copper or nickel, which has good solderability and mechanical strength.
Typical Shapes of Compound Contact Profile
This structure not only meets the high-performance requirements but also effectively reduces the amount of precious metals used, thus reducing costs.
Preparation Process of Compound Contact Profiles
According to the process of interlayer compound, the preparation process of compound contact profiles can be divided into the following categories:
1. Rolling welded bonding process
The welding is completed by applying current and pressure to the strip using a rotating electrode. This process is suitable for the preparation of longer strips, but the requirements for surface treatment are very high.
2. Rolling-deposition bonding process
The intermediate layer is bonded to the substrate layer by rolling, while the electrical contact layer is attached to the intermediate layer using deposition technology (e.g. electroplating or physical vapor deposition). The strips manufactured by this method are dimensionally accurate, but the process is complex and not suitable for mass production.
3. Explosive bonding process
With the instantaneous energy of an explosive blast, the materials are bound, and the bound quality is excellent, but it is not suitable for mass production, mainly used for wide strips.
4. Rolling bonding process
The three layers are directly bound together by rolling technology. This method is suitable for the mass production of long-strip material, but the precision requirements of the equipment are higher.
5. Diffusion welding - physical vapor deposition (PVD) bonding process
Diffusion welding technology is first used to bond the intermediate layer with the substrate layer, and then PVD technology is used to add the electrical contact layer. The process of bond quality is high, but the equipment investment is large.
Process Development and Application Prospects
The domestic production of compound contact profiles is still in its infancy, but some enterprises have developed a mature process. For example,
Fudar Alloy Materials Co., Ltd. has successfully prepared shaped compound contact profiles suitable for high-current automotive relays through technological innovation.
In the future, with the miniaturization of electrical appliances, and the development of diversified performance, compound contact profiles will face higher requirements. The following directions are worthy of attention:
1. Optimise the thickness of the precious metal layer: Improve stability and reduce material costs.
2. Develop new intermediate layer materials: Such as silver-based metal oxides to meet higher current and power requirements.
3. Improve production efficiency: To achieve mass production and reduce market price.
Conclusion
Advanced contact profiles are a breakthrough in electrical contact materials and key to future appliance performance. Through continuous optimization of processes and the development of new materials, this high-performance material will make its mark in more application scenarios, providing a reliable guarantee for the safety and efficiency of electrical appliances. If you have any questions about compound contact profiles, please feel free to contact us.
